BTU’s Pyramax™ family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging.
Pyramax™ reflow ovens provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry.
With 6, 8, 10 and new 12-zone air or nitrogen models, 350°C maximum temperature and a comprehensive menu of options, Pyramax™ reflow ovens are the industry’s most versatile performers and best value. The Pyramax features BTU's proprietary WINCON™ control system. WINCON features a simplified user interface and incredibly powerful analytical capabilities.
Watch the video below to see how the Pyramax outperforms the compeition on uniformity, throughput and exit temperature.