The ideal solution for semiconductor, hybrid and high-end SMT applications
The DEK Galaxy platform brings the efficiency and precision of modern printing methods to the world of semiconductor production and hybrid-packaging applications. It sets new industry standards in advanced semiconductor packaging with regard to yield, repeat accuracy and efficiency.
High-precision linear drives and powerful camera systems provide the basis for the extremely fast and accurate performance of the
DEK Galaxy. With transport options for highly precise wafer pallets and the printing of substrates with innovative tooling technologies like DEK Virtual Panel Tooling (VPT), the DEK Galaxy satisfies even the most demanding requirements. And with the DirEKt Ball Placement option, you can realize higly precise wafer printing and screen printing processes, from very precise wafer bumping to the direct setting of solder balls down two diameters of 0.2 mm.
Get in touch with us. Our semiconductor process experts will gladly put together a DEK Galaxy configuration that is optimized for your specific needs. Thanks to the machine’s modular design, you will always be flexible and able to find the right solution as your requirements change.
If you need a highly precise and exceptionally powerful printer platform for high-end SMT applications in the ultra-fine-pitch range, the DEK Galaxy is the solution of choice.
Linear drives for maximum precision: Repeat accuracy of ±12.5 µm @ 2 Cpk (6 sigma) for demanding wafer, substrate and PCB applications
ProFlow® DirEKt Imaging technologies for high-precision ball placements
Modular: Flexibly configurable with toolings and transport systems for the widest range of wafer and advanced packaging applications
SMEMA-compatible interfaces to wafer and flux solutions
SECS/GEM interface to higher-level systems
Fast: Core cycle time of only 7 seconds
Flexible: Product changeovers take less than 2 minutes
Easy operation with DEK Instinctiv™ software
Technical Data for the DEK Galaxy
Machine Features DEK Galaxy
Repeat accuracy ± 12.5 μm @ 2.0 Cpk (± 6 sigma)#
Printing accuracy ± 12.5 μm @ 2.0 Cpk (±6 sigma)#
Standard cycle time 7 sec
Maximum printing surface 510 mm* (X) x 508.5 mm (Y)
Maximum substrate size 620 mm (X)* x 508,5 mm (Y)#
Frame variants 305 mm to 736 mm (12"** to 29"), max. frame thickness: 38 mm
User interface Touchscreen, keyboard and trackball, DEK Instinctiv V9TM software
Camera HawkEye® 1700
Squeegee adjustment Software controlled, motorised with closed loop feedback
Stencil positioning Automatic loading incorporating squeegee drip tray
Stencil alignment Motorised via actuators X, Y, and Theta
Printing speed 2 mm/sec to 300 mm/sec
Fiducial recognition Automatic fiducial recognition, programmable from 0.1 mm to 3 mm
Understencil Cleaning Cyclone high speed cleaner, fully programmable with wet/dry/vacuum wipe with external solvent tank
Compressed air supply 5-8 bar at 5 liters/minute
Power supply 110 V to 240 V ±10 %, 50/60 Hz
Weight Approx. 680 kg
# DEK’s machine accuracy and repeatability qualification is certified by 3rd party and undertaken using production environment
process variables. Print Speeds, Print Pressures, Rising Table and Camera Movements are included in the process capability figure.
* For print area up to 600 mm long please contact the Product Manager.