E by DEK Screen Printer

E by DEK Screen Printer
E by DEK Serigrafi Baskı MakinesiE by DEK Serigrafi Baskı Makinesi -1E by DEK Serigrafi Baskı Makinesi -2
E-Quality DEK’s experienced printing specialists have developed an innovative platform for E by DEK with high-quality components, sophisticated construction, and modular design that guarantees a stable and reliable printing process even for the latest fine-pitch applications. E-Performance The ...Read more

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E-Quality

DEK’s experienced printing specialists have developed an innovative platform for E by DEK with high-quality components, sophisticated construction, and modular design that guarantees a stable and reliable printing process even for the latest fine-pitch applications.

E-Performance

The E by DEK delivers E-Performance with:

    8 seconds core cycle time
    Fast setup changeovers
    High repeatability

With the shortest cycle times and the fastest product changeovers paired with maximum repeat accuracy, the E by DEK sets new standards in the mid-speed segment.

E-Facts

Clearly structured, and each number provides a strong argument: The most important facts and figures on the E by DEK.

 

Alignment 
 > 2.0 Cmk @ ± 12.5 μm (± 6 sigma)
  
System alignment capability  > 2.0 Cmk @ ± 25 μm (± 6 sigma)
Optimum core cycle time 8 seconds
Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y)
Operating System Windows 7 Embedded
Squeegee pressure mechanism Software-controlled, motorized with closed loop feedback
 Stencil positioning  Semi-auto stencil load with drip tray
 Understencil cleaning  

Interchangeable understencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe

 Adjustable-width stencil mount (AWSM) Frame variants - fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm
Substrate thickness 0.2 mm to 6 mm
Substrate weight (maximum) 6 kg
Substrate warpage Up to 7 mm including substrate thickness
Substrate fixture

Over the top clamp

Edge clamp

Foil-less clamp

Vacuum

Temperature & humidity sensor Monitoring of the process environment

                                  

* Alignment qualifications include board loading/unloading, board clamping, camera/table movement. Capability value is calculated with 3rd-party QC-Calc software.

# Machine capability comprises board loading/unloading, board clamping, camera/rising table movement and print process. The capability value is calculated with 3rd-party QC-Calc software.

E by DEK

Flexibility at its best!

Each SMT factory has its own special challenges. That is why we have developed Options for the E by DEK that allow custom tuning with perfectly coordinated modules for printing results that will make your customers happy and raise your SMT production to a new level.

E by DEK Options for all your applications:

    Throughput
    Quality
    Flexibility
    Long and heavy circuit boards

 

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Brand: ASM DEKASM DEK
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