SIPLACE X: The ultimate SMT production line
Among electronics manufacturers, the SIPLACE X-Series is considered the benchmark wherever maximum speed and absolute precision are required (mobile phones, tablets, notebooks, LED placement, etc).
Put its top-of-the-line speed, lowest dpm rates, consistent 0201 (metric) capability, non-stop setup changeovers and fast new product introductions to use for you.
The SIPLACE X-Series is available with two, three or four gantries with gantry modularity.
Hard to believe? We look forward to hearing from you – and to a comparison with other manufacturers' machines. Find out how you can optimize your specific production processes with the SIPLACE X-Series, how quickly it will pay for itself, and what other competitive advantages it offers.
The X-Series has features which no other equipment manufacturer can offer
The world's fastest placement head. It handles evenm 0201 (metric) components with no loss of speed.
The world's only placement head that can switch between Collect & Place, Pick & Place and Mixed Mode on demand
Because the software plays an increasingly important role in electronics production
What do you need? The SIPLACE X-Series operates with one or two tracks.
Intelligent, contactless power supply, highly precise, reliable, low maintenance requirements
SIPLACE vision system
Our digital cameras miss nothing – your guarantee for maximum process reliability.
Technical Data for the SIPLACE X-Series
Machine Features SIPLACE X4i S - SIPLACE X4 S - SIPLACE X3 S - SIPLACE X2 S
Number of gantries 4 - 4 - 3 - 2
IPC Value 150,000 cph - 150,000 cph - 78,100 cph - 52,000 cph
SIPLACE benchmark 150,000 cph - 125,000 cph - 94,500 cph - 64,000 cph
Theoretical value 200,000 cph - 170,500 cph - 127,875 cph - 85,250 cph
Machine Size 1.9 x 2.3 1 - 1.9 x 2.3 1 - 1.9 x 2.3 1 - 1,9 x 2,3 1
Placement Head Features SpeedStar MultiStar TwinStar
Component spectrum 0201 (metric) - 6 x 6 mm 03015 - 50 x 40 mm 0201" - 200 x 125 mm
Placement accuracy ± 41 μm/3σ ± 41 μm/3σ (C&P) ± 22 μm/3σ ± 34 μm/3σ (P&P)
Angular accuracy ± 0,5°/3σ ± 0,4°/3σ (C&P) ± 0,05°/3σ ± 0,2°/3σ (P&P)
max. Component Height 4 mm 11,5 mm 25 mm
Placement Force 1,3 - 4,5 N 1,0 - 10 N 1,0 - 15 N 2
Transport Types Single Transport, Flexible Dual Transport
Transport Modes Asynchronous, synchronous, i-placement (X4i S)
PCB format 50 x 50 mm to 650 x 560 mm max. (X4 S, X3 S, X2 S) 3
50 x 50 mm to 610 x 560 mm max. (X4i S)
PCB thickness 0,3 to 4,5 mm (other thicknesses upon request)
PCB weight 3 kg max.
Component Supply and Feeding
Feeder positions X3 S & X4 S: 160 tracks with 8 mm X-feeders
X4i S: 148 tracks with 8 mm X-feeders
SIPLACE component cart, SIPLACE Matrix Tray Changer (MTC) 4,
Wafflepack Changer (WPC5/WPC6) 4, JTF-S/JTF-M
Tray, stick magazine, bulk case, application-specific OEM feeder modules
Pickup rate ≥ 99,95% 5
DPM rate ≤ 3 dpm 6
Lighting levels up to 6
Performing professional maintenance in the scope and intervals recommended by ASM ensures that your SIPLACE equipment will deliver the specified performance and accuracy across its entire life cycle. Our various maintenance contracts make this job even easier for you.
1 Only for main body
2 maximum placement force 30 N possible with the Option SIPLACE HighForce Head
3 up tp 850 mm with Input- & Output Conveyor Extensions
4 only for SIPLACE X2 S, X3 S and X4 S - not for SIPLACE X4i S
5 Cannot be combined within the same placement area
6 According to evaluation criteria