Quick EA-H15 BGA Rework

54.251 5 Review(s)
Repair system with the increased power for soldering and desoldering various components. The system is an upgraded version of QUICK BGA2015 station and consists of the QUICK IR EA-H15 infrared rework station, QUICK PL EA-H15 precise laser mounting system, QUICK RPC EA-H15 visualization camera. ...

Contact us for more information

Share
Brand

Repair system with the increased power for soldering and desoldering various components.

The system is an upgraded version of QUICK BGA2015 station and consists of the QUICK IR EA-H15 infrared rework station, QUICK PL EA-H15 precise laser mounting system, QUICK RPC EA-H15 visualization camera.

FEATURES
Perfect for soldering and reworking of CBGA, CCGA, CSP, QFN, MLF, PGA and others.
Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution.
PL Precise aligning and placing system: visible double-colors optical lens alignment, overlap alignment between solder ball and soldering pad is scientific and accurate; easy control, and pick-up and placement.
The whole process can be recorded, controlled and analyzed and then generate curve diagram by connecting to PC using IRsoft Software.
Programmable soldering control system, 10 modes storage memory, password protection
Bottom heater large size prevents the PCB from irregular heating and damage
Microprocessor control and low-inertial heaters ensure the maximum thermal stability
Laser LED pointer to highlight the operation area center
Built-in vacuum pump for component pick-up (max 0.05 MPa)
Upper LED light: blue color, adjustable brightness
Lower LED light: yellow color, adjustable brightness
Multi-purpose holder frame with flexible fixation for tiny and complex-shape PCBs included
Monitor (option)
Upper and bottom cooling fans included

TECHNICAL SPECIFICATIONS

General Power    2400 W (max.)
Top Heater Power    720 W (120 W×6, infrared heating tube, wavelength: 2~8 µm)
Bottom Heater Power    1600 W (400 W×4, infrared ceramic heater) – standard
2000 W (500 W×4, infrared ceramic heating tubes) – option
Top heater range size    20 ~ 60 mm (X, Y axes alignment)
Bottom Heater Size    260×260 mm
Max PCB Size    400×400 mm
Max SMD (BGA) Components Size    60×60 mm
Temperature Sensor    Infrared, 0…300°C
Positioning Camera    Magnification:: 220x (22x optical + 10x digital), Horizontal resolution: 480 TV lines, PAL format, power 12 V/300 mA
RPC Visualization Camera    Magnification: 220x (22x optical + 10x digital), Horizontal resolution: 480 TV lines, PAL format
Dimensions (L×W×H)    850×720×730 mm
Weight    ~ 75 kg

List of the comments:


No comments have been posted yet.
Vote: ( 5 )

Give your advice about this item:

Specifications

Social Media

Please follow AssemCorp on social media!

 

Latest Tweets

Ramazan Bayramınız Kutlu Olsun.
19 Mayıs Atatürk’ü Anma, Gençlik ve Spor Bayramı kutlu olsun. Milli mücadelenin başladığı bu anlamlı günü gençlere armağan eden, Türkiye Cumhuriyeti’nin kurucusu M.Kemal Atatürk ile Kurtuluş savaşı kahramanları şehit ve gazilerimizi şükranla ve rahmetle anıyoruz.
23 Nisan Ulusal Egemenlik ve Çocuk Bayramı kutlu olsun! #23Nisan1920 #23NisanKutluOlsun
Electrotech fuarının son günü! Koh Young AOI ve SPI makinelerini standımızda görebilir, detaylı bilgi alabilirsiniz. Fuar bugün 17:30’a kadar açık. Bekliyoruz. 7 salon, D-120’deyiz.
Electrotech fuarının üçüncü gününde sona geldik. Yarın fuarın son günü. ASM E by SIPLACE smd dizgi makinesi, E by DEK serigrafi baskı makinesini görebilmek için son şans. Kaçırmayın. 7 salon D-120’deyiz.

Contact

AssemCorp Elektronik A.Ş.

Newsletter

Subscribe to receive latest news from us