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L29-145HF Solder Paste is a low temperature solder paste.
Benefits :
- Reduce consumption energy
- Eliminate Flow soldering process
- Non Wet Open decrease
L29 – 145HF Type4
L29: Senju Ecosolder L29(Sn-58Bi-Sb-Ni)
145HF: Flux model
Type4: (20-38μm per IPC J-STD-005) available upon request
Alloy Composition | L29 (Sn-58Bi-Sb-Ni) |
---|---|
Melting Temperature | 140 - 145 ℃ |
Powder Shape | Spherical |
Particle Size | Type4 (20-38μm) |
Technical Specifications
Flux Classification | ROL0 (J-STD-004B) |
---|---|
Halogen Content | Less than 900ppm (EN 14582) |
Halide Content | 0.02% or less (JIS Z 3197) |
Cu Plate Corrosion Test | Pass (JIS Z 3197) |
Cu Mirror Corrosion Test | Pass (JIS Z 3197) |
Surface Insulation Resistance Test | Over 1.0E+9 Ω (JIS Z 3197) (40℃/90%RH, 168h) |
Electro Chemical Migration Test | Over 1.0E+8 Ω, No Migration (JIS Z 3197) (85℃/85%RH, 1000h) |
Flux Content | %10.5 (JIS Z 3197) |
Viscosity | 190Pa・s (JIS Z 3284) |
Thixotropic Index | 0.60 (JIS Z 3284) |
Slump Test | Cold 0.3mm Hot 0.3mm (JIS Z 3284) |
Tackiness Test Over | 1.0N within 24h (JIS Z 3284) |
Solder Ball Test | Rank 2-3 (JIS Z 3284) |
Validity | 6 months (Unopened, Keep at 0-10 ℃) |
https://www.assemshop.com/urun/senju-kursunsuz-krem-lehim-l29-145hf-dusuk-isida-eriyen-lehim |