Almost all commercially-produced electronic devices use printed circuit boards (PCBs) to mechanically support and electronically connect electronic components. One step in circuit board manufacturing is the reflow soldering process, where the most critical part is melting the solder and heating the adjoining surfaces without overheating or damaging the electrical components.
Knowing what happens to the circuit board as it passes through the reflow oven is critical to the profitability of your business. Knowing the temperature distribution helps identify uneven or high rates of heating, solve imbalances in temperature across the reflow oven.
The Datapaq® Reflow Tracker® temperature profiling system travels through the process, enabling you to monitor wave and reflow soldering processes, as well as vapor phase, selective soldering and rework stations. With this system, you can learn more about your process, maximize product throughput, yield and profits, and reduce waste.