SMT is the abbreviation of the initials of the English words "Surface Mount Technology".

The production technology that uses surface mountable electronic components is called Surface Mount Technology. Before the use of surface mount elements, which are abbreviated as SMD to represent the initials of their English meaning, circuit assemblies could only be made with pinned circuit elements. Surface mount elements can be manufactured in much smaller sizes than pinned elements. Serial SMDs can be assembled with machines that include assembly robots. In this way, it is possible to design serial production and more miniature electronic circuits. Pinned circuit elements must be soldered by inserting them into holes in electronic cards and dipping them into a molten solder chamber, while SMDs are mounted directly on the card surface and then baked. The smallest chip component currently available in the industry is 008004 Size (0.25 x 0.125 mm). While small chips are mostly used only in devices that require high technology and require a small footprint (especially mobile phones, handheld computers, RF modules, etc.), it is possible to see larger SMDs in all types of electronic devices produced with surface mount technology.