Solder Preform is pre-forms of solid solder alloys with potential to change the future. Combination of machining technologies such as rolling and pressing are used to process the solder alloy into various shapes, allowing the solder to be used effectively. With the evolution of the soldering process, SMIC has developed ECO SOLDER PREFORM that has various structures to help customer's innovation.

Solder preform structures can be as follows :

  • Single layered
  • Ni balls contained
  • Flux cored
  • Flux coated
  • Solder coated metal
  • Double Layered

And the shapes may be ribbon, square, disk, washer, chip, wire and etc. 

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