Datapaq® has been supplying temperature profiling solutions into the solar photovoltaic manufacturing industry for many years. As part of our continuing product innovation, we now offer two solutions for profiling the vacuum lamination process.
The temperature profile that the module is subjected to during the lamination process is critical to the correct curing of the ethylene vinyl acetate (EVA) and as such, has a direct effect on module lifetime. Datapaq SolarPaq temperature profiling systems enable the process to be monitored without disrupting normal production. The logger and its associated thermocouples are placed into the laminator, along with the module to be monitored. The system passes through the laminator and on exiting, the temperature profile information can be downloaded and analyzed.
A Complete Solution
By monitoring temperatures at up to 10 points across the entire surface of the module, the Datapaq system provides the engineer with the information needed to set up and optimize their process.
This system has been designed to eliminate the need for trailing long leads in and out of the laminator press and is therefore, significantly safer in operation than existing methods of profiling. The barrier and its surrounding frame have been designed, following consultation with equipment manufacturers, to ensure minimal stress on the laminator transport and membranes.
Benefits
• Safely profile the lamination process
• Obtain accurate repeatable results, enabling process optimization
• Save time and money setting up or adjusting process throughput
• Enable regular monitoring of process performance to be conducted quickly and easily
Solar InsightTM Software
This software has been designed specifically for use within the photovoltaic (PV) solar industry and contains many process-specific analysis displays. Wizards guide the users step-by-step to quickly obtain the data and analysis of the required results. This ensures that both experienced and novice users can obtain maximum benefit in the shortest possible time.
