Our placement solution for high-mix electronics production
Attractive Financing
With the SIPLACE SX, your factory is ready for anything that comes along.
The SIPLACE SX was designed to be flexible. It is the world’s only platform that lets you scale up or down or transfer capacity by adding or removing the unique SX gantries.
With the SIPLACE SX we have made our most successful placement solution even better:
Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily
The SIPLACE SpeedStar for high-speed and placement of components as small as 0201 (metric) with maximum precision
SIPLACE TwinStar: The head for special tasks
SIPLACE MultiStar: Switches between placement modes on demand
Smart Transport Module: Process PCBs with lengths of up to 1.525 meters
LED centering: Align components based on top-side features
Place critical components reliable with the SIPLACE OSC Package
Touchless placement: Maximum placement quality for highly sensitive components
SIPLACE SpeedStar and SIPLACE MultiStar heads can operate jointly in the same placement area for more flexibility and performance.
Minimum placement force: 0.5 N
SIPLACE Smart Pin Support: Automated pin support for printed circuit boards
NEW: Up to 17% higher performance
Technical data* |
SIPLACE SX1 |
SIPLACE SX2 |
Placement speed** |
43.000 cph |
86.500 cph |
Placement speed (IPC) |
33.000 cph |
66.000 cph |
Feeder capacity |
120 × 8 mm slots |
|
Component spectrum |
0201 (metric) to 200 mm × 125 mm × 50 mm |
Board size |
50 mm × 50 mm to 1.525 mm × 560 mm |
Machine dimensions (L x W x H) |
1,5 m × 2,8 m × 1,8 m |
Placement heads |
SpeedStar (CP20P2), MultiStar (CPP), TwinStar (TH) |
Placement accuracy |
22 µm @ 3 σ (with TwinStar) |
Conveyors |
Single-track conveyor, flexible dual-track conveyor |