M705-ULT369 is newly designed solder paste to be state-of-the-art. More user-friendly, achieving a high workability.
Low Void
The trend to high-capacity and high-speed communication puts heat radiation into focus.
In this connection, voiding became an important character in terms of soldering. ULT369 has a high flowability. Voids are easily discharged from solder. Even in case of subdivided pattern, ULT369 is able to decrease the voiding.
High Printability
ULT369 has a high printability. Especially the filling/releasing ability is increased. This contributes to the printability at small openings and narrow pitches. ULT369 has an excellent temporal stability to achieve high productivity.
High reflowability
- Electric parts become smaller and smaller, and require thus a smaller solder powder size. Smaller solder powder oxidizes easily, affecting the solderability. ULT369 can keep its solderability with high heat resistance.
- BGA Packages become thinner and thinner, bending more easily.
This can cause HiP (Head in Pillow) and NWO (Non-wet Open) issues. ULT369 overcomes those problems with its outstanding wettability.
- Its high wettability can help soldering difficult places like QFN edges.
Alloy Name M705
| Alloy Composition (%) |
Sn-Ag3.0-Cu0.5 |
|---|
| Specific Gravity |
7.4 |
|---|
| Melting Temp. (°C) |
Solidus 217
Liquidus 220 |
|---|
| Tensile Strength (MPa) |
53.3 |
|---|
| Elongation (%) |
56 |
|---|
| Young’s Module (GPa) |
46.9 |
|---|
| 0.2 Yield Point (MPa) |
39.4 |
|---|
| CTE (ppm/ C) |
21.7 |
|---|
| Vickers Hardness (Hv) |
17.9 |
|---|
Solder paste characteristics change corresponding to temperature. There is a tendency for viscosity to become lower (softer) at high temperature. Slumping and/or spreading in the printing stage and solder ball or bridging in reflow stage may potentially occur if the paste has lower viscosity. Conversely, sticking to squeegee and/or clogging to stencil aperture may occur if viscosity is higher. Therefore, suitable environmental conditions are preferred for this paste’s use. 25+/-3°C temperature is usually recommended for this product.
