Sparkle Paste OZ 221CM5 series is No-clean leaded solder type with characterized by Soldering high workability and High reliability soldering.
Until the finish of the product from the printing process, OZ 221CM5 series also allows you to high quality in various situations in the process SMT.
Printing process
High print resolution, the suppression of the fine pitch printing, printing of bleeding is good. In addition, excellent in continuous operation.
Reflow process
Less occurrence of solder balls, showing a good wettability.
Reliability
- Shows high reliability in flux residue and after soldering the implementation.
- OZ 221CM5 series is low shapeless and less viscosity change at the time of continuous printing, and enables stable printing.
- OZ 221CM5 series is good wettability at the time of reflow and after leaving the print exhibit good wettability though.
| Solder Powder Alloy Composition |
Sn63Pb37 |
|---|
| Melting Temperature |
183°C DSC |
|---|
| Powder Shape |
Spherical SEM |
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| Particle Size |
Type3 (25-45μm) Type4 (20-38μm) SEM, Screen Method |
|---|
| Solder Paste Flux Classification |
ROL0 J-STD-004B |
|---|
| Halogen Content |
Less than 500ppm EN 14582 |
|---|
| Halide Content |
0.02% or less JIS Z 3197 |
|---|
| Cu Plate Corrosion Test |
Pass JIS Z 3197 |
|---|
| Cu Mirror Corrosion Test |
Pass JIS Z 3197 |
|---|
| Surface Insulation Resistance Test |
Over 1.0E+11Ω JIS Z 3197 (40°C/90%RH, 168hours) |
|---|
| Electro Chemical Migration Test |
Over 1.0E+9Ω No Migration JIS Z 3197 (85°C/85%RH, 1000hours) |
|---|
| Flux Content |
9.8% JIS Z 3197 |
|---|
| Viscosity |
180 Pa・s JIS Z 3284 |
|---|
| Thixotropic Index |
0.60 JIS Z 3284 |
|---|
| Slump Test |
Cold 0.3mm/Hot 0.3mm JIS Z 3284 |
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| Tackiness Test Over |
1.0N within 24hours JIS Z 3284 |
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| Solder Ball Test |
Rank 1-2 JIS Z 3284 |
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| Validity |
6 months
Unopened, Keep at 0-10°C |
|---|
※The values in this table are for reference.
