Sparkle Paste OZ 221CM5 series is No-clean leaded solder type with characterized by Soldering high workability and High reliability soldering.
Until the finish of the product from the printing process, OZ 221CM5 series also allows you to high quality in various situations in the process SMT.
Printing process
High print resolution, the suppression of the fine pitch printing, printing of bleeding is good. In addition, excellent in continuous operation.
Reflow process
Less occurrence of solder balls, showing a good wettability.
Reliability
- Shows high reliability in flux residue and after soldering the implementation.
- OZ 221CM5 series is low shapeless and less viscosity change at the time of continuous printing, and enables stable printing.
- OZ 221CM5 series is good wettability at the time of reflow and after leaving the print exhibit good wettability though.
Solder Powder Alloy Composition: Sn63Pb37 ---
Melting Temperature: 183°C DSC
Powder Shape: Spherical SEM
Particle Size: Type3 (25-45μm) Type4 (20-38μm) SEM, Screen Method
Solder Paste Flux Classification: ROL0 J-STD-004B
Halogen Content: Less than 500ppm EN 14582
Halide Content. 0.02% or less JIS Z 3197
Cu Plate Corrosion Test: Pass JIS Z 3197
Cu Mirror Corrosion Test: Pass JIS Z 3197
Surface Insulation Resistance Test: Over 1.0E+11Ω JIS Z 3197 (40°C/90%RH, 168hours)
Electro Chemical Migration Test: Over 1.0E+9Ω No Migration JIS Z 3197 (85°C/85%RH, 1000hours)
Flux Content: 9.8% JIS Z 3197
Viscosity: 180 Pa・s JIS Z 3284
Thixotropic Index: 0.60 JIS Z 3284
Slump Test: Cold 0.3mm/Hot 0.3mm JIS Z 3284
Tackiness Test Over: 1.0N within 24hours JIS Z 3284
Solder Ball Test: Rank 1-2 JIS Z 3284
Validity: 6 months
Unopened, Keep at 0-10°C
※The values in this table are for reference.
