QUICK W5050-2S+ Selective Soldering Machine

QUICK W5050-2S+ Selective Soldering Machine
The QUICK W5050-2S+ Selective Soldering Machine is an advanced selective soldering solution designed for large PCBs and high-volume production. Featuring a dual-pot and dual Z-axis architecture, the system is supplied as standard for in-line production lines and is developed with a focus on stable p ...Read more

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The QUICK W5050-2S+ Selective Soldering Machine is an advanced selective soldering solution designed for large PCBs and high-volume production. Featuring a dual-pot and dual Z-axis architecture, the system is supplied as standard for in-line production lines and is developed with a focus on stable process control and high productivity.

Dual Pot, Dual Z-Axis Architecture

The W5050-2S+ model features:

  • Two solder pots
  • Dual Z axes
  • A single soldering area

Thanks to the dual Z-axis design, the two pots can be controlled independently, providing increased flexibility in the soldering process. This structure helps optimize cycle times, particularly in production lines dedicated to serial manufacturing of a single product.

Large Working Area for Oversized PCBs

With an effective working area of 500 × 500 mm, the machine supports PCB sizes up to 508 × 508 mm. This capability allows safe and reliable integration of large boards or panel-based assemblies into the selective soldering process.

Vision-Assisted Programming and Positioning

The QUICK W5050-2S+ is equipped with an intelligent vision system supporting:

  • Automatic mark point recognition
  • Fiducial-based position correction

Soldering paths can be programmed quickly and easily using:

  • PCB images
  • Gerber files
  • Online or offline programming
  • CCD scanning methods

Controlled Fluxing and Preheating

The system performs precise dot and line applications using a micro-jet fluxing method. A minimum coating width of 2 mm helps reduce ionic contamination on the PCB. Flux flow and liquid levels are continuously monitored.

Preheating is carried out using infrared and hot-air methods. Temperature values are monitored both through the system and via independent third-party monitoring, ensuring a safe and stable thermal profile.

Stable Soldering Process

During soldering, the system provides:

  • Solder temperature monitoring
  • Automatic measurement of wave peak height
  • Continuous nitrogen (N₂) protection throughout the entire process

These features help improve solderability and achieve consistent solder joint quality.

The electromagnetic pump used in the machine contains no mechanically moving parts and delivers:

  • Constant flow
  • Stable temperature
  • Consistent wave height

This design significantly reduces maintenance requirements.

Line Integration and Conveyor Features

The QUICK W5050-2S+ supports seamless integration into various in-line production lines with:

  • SMEMA-compliant communication
  • Adjustable conveyor width: 70–508 mm
  • Top clearance: 100 mm
  • Bottom clearance: 60 mm

Optional Configurations

Available options for the W5050-2S+ include:

  • Automatic solder wire feeding module
  • Flux flow monitoring module
  • Heavy-duty conveyor (20 kg)
  • MES system integration
  • Automatic nozzle cleaning

 

Brand: QuickQuick
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